SMT Reflow Oven | TRA
SMT Reflow Oven | PCB reflow machine
SMT Reflow Oven is an 8‑zone hot‑air convection It is designed for precision soldering of PCB and LED assemblies using lead‑free or standard solder pastes.
- Max PCB size is about 280×280 mm, Conveyor speed is adjustable and Power usage is ~3.5 kW during operation.
- It has 8 heating zones (4 top, 4 bottom) and Uses hot-air convection heating, Heating length is 1400 mm.
- Device weight is around 250 kg and Operating temperature can reach ~400 °C.
- Controlled via PID digital or touch screen, Has 2 natural cooling zones.
| Feature | Description |
| Model | |
| Device Type | SMT Reflow Oven |
| Heating Method | Hot-air convection |
| Heating Zones | 8 zones (4 top, 4 bottom) |
| Cooling Zones | 2 zones (natural air cooling) |
| Max PCB Size | 280 × 280 mm |
| Heating Length | 1400 mm |
| Conveyor Width | Approx. 300 mm |
| Conveyor Speed | Adjustable from 160 to 1350 mm/min |
| Power Consumption (Operation) | Approx. 3.5 kW |
| Power Consumption (Startup) | Approx. 11 kW |
| Warm-up Time | Around 15–20 minutes |
| Temperature Range | Up to ~400 °C |
| Control System | PID digital controller or 7″ touchscreen (model-dependent) |
| Machine Dimensions | 2440 × 680 × 1200 mm |
| Weight | Approx. 250 kg |
| Application | Ideal for PCB and LED reflow soldering in small/medium production lines |
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